IEEE Transactions on Components Packaging and Manufacturing Technology

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期刊ISSN：	2156-3950
E-ISSN：
影响因子：	2.3
自引率：	13%
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出版语言：	英文
期刊分类：

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出版信息
出版商	Institute of Electrical and Electronics Engineers Inc.
期刊官网	https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=PER240-PRT
涉及的研究方向	ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
年文章数	0
是否OA	否
APC费用
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期刊简介
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

期刊简介

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.